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Advanced Precision Curing Oven for Oxygen-Free Baking Solutions
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Oxygen-Free Environment: Continuous nitrogen filling ensures low-oxygen and clean working chamber for oxidation-free processes.
Temperature Uniformity: Horizontal air recirculation and precise deflector control ensure uniform temperature distribution.
Nitrogen Saving System: Pressure reducing valve and double flow meter system reduce nitrogen consumption in anaerobic environments.
Stable High-Temp Performance: High-power motor and stainless steel turbine blades allow stable long-term operation at high temperatures.
Customization Available: Flexible customization options available to meet specific customer needs and requirements.
ISO Certified Quality: Equipment meets ISO certification standards ensuring high quality and reliability.
Versatile Applications: Suitable for PI, BCB, LCP curing, photoresist curing, and electronic ceramic material drying.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the control accuracy of the temperature?
A:
The control accuracy is 0.1 degrees Celsius with PID adjustment.
Q:What is the oxygen content range?
A:
The oxygen content range varies by model, from 1-5 percent down to less than or equal to 100PPM.
Q:What is the heating rate capability?
A:
The heating rate is adjustable, rising from room temperature to 175 degrees Celsius in about 20 minutes without load.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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