What is the minimum order quantity?

The minimum order quantity is 1 set.

Advanced Precision Five Axis Laser Machining System for Engineering

Name: Advanced Precision Five Axis Laser Machining System for Engineering
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 1961750921

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

Negotiable

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Warranty

One Year Service

Application

Metal

Process Usage

Metal-Cutting CNC Machine Tools, CNC Non-Conventional Machine Tools, Metal-Forming CNC Machine Tools

Movement Method

Point to Point Control

Control Method

Open-Loop Control

Numerical Control

CNC/MNC

Processing Precision

0.01~0.02(mm)

Performance Classification

High-End CNC Machine Tools

Certification

CE, RoHS

Condition

Used

Product Name

Laser Micro Nano Machine

Laser Type

Ultra Fast Pulsed Laser

Wavelength

1064nm,532nm,355nm

X/Y/Z Axis Positioning Accuracy

+-2μm / +-2μm / +-4μm

Drilling Module Aspect Ratio

Helical:1:20, Five-Axis Galvanometer: 1:10

Transport Package

Packed with Wooden Box by Sea Shipping

Specification

400KG

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Ultra Fast Pulsed Laser: Features selectable wavelengths of 1064nm, 532nm, and 355nm with integrated dual/triple-path systems.

Five-Axis Precision Machining: Achieves 3D micro-machining of inclined, conical, and spherical surfaces with high-end control.

Minimal Heat Affected Zone: Ultra-short pulse technology minimizes surface heat effects and residual debris during processing.

Wide Application Scope: Suitable for aerospace, automotive, microelectronics, mold processing, and biomedical fields.

Flexible Customization: Offers OEM, ODM, and design services with flexible customization options available.

Comprehensive Warranty: Includes one-year warranty coverage for the equipment.

24/7 Technical Support: Provides 24-hour online professional technical support for all customers.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.34h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What are the available laser wavelengths?

The system supports selectable wavelengths of 1064nm, 532nm, and 355nm with integrated dual-path and triple-path systems.

Q:What industries can this machine be applied to?

Applications include aerospace, automotive, microelectronics, mold processing, tribology, semiconductor electronics, and biomedical fields.