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Advanced Precision Laser Cutting Systems for FPCB Manufacturing
US$50,000.00-100,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Warranty

12 Months

Model NO.

LCM-03

Application

Automotive Industry

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Metal

Structure Type

Desktop

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Uph

Customized

Positioning Accuracy

<5μm

Cutting Accuracy

±30μm

Laser Spot Size

φ = 12 μm

Laser Power

10W / 15W / 20W / 30W

Machine Power Consumption

≤ 5 Kw

Power Supply

AC 380V

Equipment Dimensions (Lxwxh)

2500 × 1700 × 1900 mm

Transport Package

Crata

Specification

3000kg

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Superior Cut Quality: Clean, colorless incisions without burrs or protrusions; minimal soot and thermal damage.
Dual-Station Efficiency: Double-click dual-station synchronous high-speed cutting for optical materials and FPCB.
Advanced Vision System: Single camera positioning and dual camera real-time tracking for high-speed sorting.
Customizable Options: Customized loader, positioning accuracy, cutting accuracy, laser spot size, and power.
Stable & Reliable: Comprehensive earthquake prevention design ensures system stability and reliability.
Flexible Compatibility: Compatible with various FPCB substrates and quick switching between different products.
12-Month Warranty: Includes 12 months warranty with 24 hours online professional technical support.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.67h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM Designing.
Q:What is the positioning accuracy?
A:
The CCD positioning accuracy is less than 5 microns.
Q:What laser powers are available?
A:
Available laser powers are 10W, 15W, 20W, and 30W.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
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