Advanced Precision Wafer Alignment Systems for Circuit Manufacturing

Name: Advanced Precision Wafer Alignment Systems for Circuit Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2083718942

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$5,000.00-20,000.00

1 Piece

Product profile

Customization

Available

Sensor Type

Reflective Optical Fiber

Wafer Size

6 to 12 Inch

Model NO.

Ag100

Alignment Time

2.5s

Transport Package

Wooden Package

Specification

50kg

Trademark

Himalaya

Origin

China

HS Code

8541590000

Production Capacity

500

Key features

SEMI S2 Certified: Product certified by SEMI S2 for semiconductor manufacturing safety and standards.

Low Particle Contamination: Designed to minimize contact area, reducing surface friction and particle contamination.

Customizable Spindle: Spindle size, shape, and material can be changed according to wafer type and size.

Bernoulli Adsorption: Utilizes Bernoulli adsorption method for precise wafer handling.

Flexible Customization: Customized design available for gaps not meeting SEMI specifications and edge shapes.

High-Speed Positioning: Determines position in 2.5 seconds without re-clamping action.

Multi-Port Communication: Supports RS232, RS485, TCP/IP, and parallel port I/O modes.

Wide Wafer Compatibility: Handles semiconductor wafers and glass substrates from 6 to 12 inches.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.66h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.