What is the typical throughput per hour?

For standard Al/TiN films (~100 nm), the 6-chamber model achieves 30-40 wafers/hour, and the 8-chamber model reaches 40-50 wafers/hour.

Advanced PVD Deposition System for High-Quality Film Coatings

Name: Advanced PVD Deposition System for High-Quality Film Coatings
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2106605122

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$50,000.00-150,000.00

1 Piece

Product profile

Customization

Available

Wafer Size Compatibility

200mm, 300mm

Chamber Platform

Modular, Cluster-Based Platform

Model NO.

PVD-01

Vacuum Level

Ultra-High Vacuum

Plasma Source Type

DC Magnetron, RF, Pulsed DC, or Ion Beam

Material Handling System

Physical Mechanism

Material

Stainless Steel

Chamber Quantity

6 to 8 Pieces

Control System

PLC

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Flexible Process Modes: Integrates DC magnetron, pulsed DC, RF magnetron, and reactive sputtering modes in a single chamber.

High Throughput Capability: 6-chamber model achieves 30-40 wafers/hour; 8-chamber model reaches 40-50 wafers/hour for standard films.

Smart Factory Integration: Features Windows-based HMI and full SECS/GEM compatibility for seamless smart factory integration.

Proven Back-Side Metallization: Validated for thinned power devices (IGBT/SiC/GaN) without edge exclusion defects.

Automated Handling System: Supports 8-sided automatic wafer handling with unipolar/bipolar continuous operation and SMIF compatibility.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.00h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:What wafer sizes does the system support?

The system supports 4-inch (100mm), 6-inch (150mm), and 8-inch (200mm) wafers, including Si, SiC, GaN, GaAs, Sapphire, and glass. It is flexible for R&D or small-scale production.

Q:What PVD process modes are available?

Available modes include STD (Standard DC Magnetron), SIP (Self-Ionized Plasma), IMP (Ionized Metal Plasma), and BGM (Bias-Graded Magnetron) for various film properties and adhesion control.

Q:What is the system uptime and MTBF?

Designed for >90% uptime in production. MTBF is >1,000 hours for critical components. Preventive maintenance schedules are provided to maximize availability.

Q:How often does the target need replacement?

Target life depends on material and usage. A standard Ti target lasts ~10,000 kWh (several months). The system includes target erosion monitoring for predictive replacement.

Q:Is the system compatible with automated wafer handling?

Yes, it supports SMIF (Standard Mechanical Interface) and automated cassette-to-cassette wafer handling for integration into Fab automation.