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Advanced Qr Code Marking System for Semiconductor Wafers
US$70,000.00-120,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursWarranty
12 MonthModel NO.
AWIME-1107Laser Visibility
VisibleApplicable Material
NonmetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
SemiconductorLaser Classification
Semiconductor LaserType
Semiconductor Laser Marking MachineMarking Method
Scanning MarkingCompatible Wafer Sizes
2-6 Inch, 4-8 Inch, 8-12 InchThroughput (Uph)
≥ 60 PCS/HourMarking Accuracy
+/-10 UmTravel Range
400 mm X 250 mmPositioning Repeatability
+/- 0.002 mmDd Motor Repeatability
+/- 2 ArcsecLaser Type
UV Nanosecond LaserAverage Power
3 WTact Time
< 60 SecondsTransport Package
Wooden PackSpecification
CustomizedTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
High Throughput Performance: Processes over 60 wafers per hour with a tact time under 60 seconds.
99.9% Yield Rate Guarantee: Closed-loop verification system prevents mis-marks and ensures data integrity.
Cold Processing Technology: 3W UV nanosecond laser prevents micro-cracks and thermal damage on sensitive materials.
Full Automation & Vision Alignment: Dual-arm DD motor robot with automatic vision system for precise positioning.
Wide Wafer Size Compatibility: Supports 2-inch to 12-inch wafers including Si, SiC, GaN, and Sapphire.
Rapid Size Changeover: Switch between wafer sizes in minutes via software recipe selection.
Comprehensive After-Sales Support: 7*24 hours technical support and 12-month warranty coverage.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.78h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How does the laser ensure high-quality marks without causing micro-cracks or thermal damage?
A:
The system uses a 3W UV nanosecond laser. The short UV wavelength allows for clean marking with minimal heat input, while the fast nanosecond pulse duration ablates the surface without transferring thermal energy to the bulk material. This 'cold processing' mechanism prevents micro-cracks and thermal alteration, making it safe for materials like SiC, GaN, and sapphire.
Q:How is the 99.9% yield rate achieved, and what happens if a mis-mark is detected?
A:
The yield rate is guaranteed by an integrated 'closed-loop' verification system. After marking, the vision system captures an image, decodes it in real-time, and compares it to the intended data. If a discrepancy is found, the system flags the wafer and routes it to a separate cassette, preventing mis-marks from proceeding and logging the error for review.
Q:How quickly can the system switch between different wafer sizes like 6-inch and 8-inch?
A:
The system is designed for rapid changeover. Switching involves selecting a new recipe in the software, which automatically configures handling parameters. The dual-arm DD motor robot accommodates the 2-inch to 12-inch range without mechanical adjustments, allowing size changes to be completed in minutes.
Q:What types of materials and wafer sizes are compatible with this system?
A:
It handles Semiconductors (Si), Compound Semiconductors (SiC, GaN, InP, GaSb), and Specialty Substrates (Sapphire, Glass, LT). It is compatible with wafer sizes ranging from 2-inch up to 12-inch.
Q:What is the warranty period and after-sales service availability?
A:
The system comes with a 12-month warranty and offers 7*24 hours after-sales service support.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
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