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Advanced Semiconductor Wafer Marking Solutions for Optimal Production
US$1,000.00-7,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
LE-01Laser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
Fiber LaserLaser Classification
Semiconductor LaserType
Semiconductor Laser Marking MachineMarking Method
Scanning MarkingProduct Name
Fully Automatic Wafer ID Marking EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Fully Automatic Operation: Features DD motor wafer dual arm handling robot and fully automatic visual positioning for error-free marking.
High Precision Technology: Adopts high-precision 2D linear motor platform and real-time verification for ultra-high precision marking.
Wide Material Compatibility: Suitable for Si, SiC, InP, GaSb, GaN, Sapphire, Glass, LT materials on 2-12 inch wafer substrates.
Flexible Customization: Offers customized solutions according to specific needs, including OEM and ODM services.
Comprehensive Warranty: Provides one-year warranty coverage for the equipment to ensure long-term reliability.
24/7 Technical Support: Delivers 24 hours online professional technical support for immediate assistance.
Verified Marking Quality: Equipped with marking content verification function to guarantee guaranteed quality and accuracy.
Global Supplier Network: Backed by over 200 customers and suppliers, exporting to over 30 countries worldwide.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.81h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials are supported?
A:
Suitable for marking on 2-6 inch, 4-8 inch, 8-12 inch Si, SiC, InP, GaSb, GaN, Sapphire, Glass, LT and other materials.
Q:What is the marking method?
A:
The equipment uses scanning marking with a fiber laser and continuous wave technical class.
Q:Is customization available?
A:
Yes, we offer customized solutions according to needs, including OEM and ODM services.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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