Advanced UV Laser Engraving Machine for Die Marking Solutions

Wafer laser marking is a high-precision, non-contact process that uses a focused laser beam to etch permanent, machine-readable identifiers (barcodes, QR codes, alphanumeric text, logos) onto semiconductor wafers. It ensures traceability, anti-counterfeiting, and process control in semiconductor manufacturing. Common Applications: Wafer ID for fab tracking, Die-level marking for IC packaging, MEMS & power electronics traceability.

An automatic die marking system integrates AI vision, robotics, and laser technology to mark individual dies on a wafer without manual intervention. Key Steps: Auto wafer loading - Robot arm picks & positions the wafer. Machine vision alignment - CCD camera locates each die. Laser marking - High-speed galvanometer scans & etches marks. Auto unloading - Marked wafers proceed to the next process. Benefits: Zero human error (fully automated), 120+ wafers/hour throughput, Sub-micron accuracy.

High-speed wafer marking systems use advanced galvanometer scanners & optimized laser parameters to achieve: 120+ wafers/hour (vs. 30-50 wafers/hour with traditional methods), Real-time vision correction for zero misalignment, Batch processing (marks multiple dies simultaneously). Example: A 300mm wafer with 1000+ dies can be fully marked in under 2 minutes.

A precision wafer ID system ensures unique, permanent, and scannable marks for: Full traceability (MES/ERP integration), Anti-counterfeiting (tamper-proof IDs), Process control (marks survive annealing, CMP, dicing). Example: 2D barcodes for wafer tracking, Encrypted serial numbers for secure authentication.

IC traceability solutions use laser marking + database integration to track chips from wafer to packaged IC. Key Components: Wafer-level marking (unique ID), In-line scanning (barcode readers), ERP/MES integration (real-time tracking). Example: Automotive chips must be traceable for recalls.