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Advanced Vertical Wafer Drying System for Semiconductor Manufacturing
US$15,000.00-1,500,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
HMLA-ZKW02Overall Dimensions
Length 1059mm* Width 959mm* Height 786mmBody Structure
Stainless Steel Skeleton + Imported PP Plate ShellProcessing Wafer Size
2 "-8" WaferParticle Increment
Customer RequirementTransport Package
Wooden CaseSpecification
CustomizedTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
High Cleanliness Performance: Achieves imported equipment performance for washing and drying semiconductor wafers.
Versatile Material Support: Suitable for silicon, GaAs, SiC, sapphire, lithium niobate, and optical lens wafers.
Programmable Control System: PSC-X touch control stores 9 recipes with steps adjustable from 0-999 seconds.
Nitrogen-Free Drying Design: Unique air intake and filtration system enables rapid drying without nitrogen.
Flexible Customization: Particle increment and body structure can be customized to customer requirements.
Easy Maintenance Structure: Features quick removal and replacement of rotor with a single bolt.
Compact Dimensions: Overall size is 1059mm(L) x 959mm(W) x 786mm(H) for efficient space usage.
Professional Technical Support: Provides 24 hours online professional technical support for equipment operation.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.66h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this system process?
A:
It can be used to wash and dry semiconductor new material wafers, silicon, gallium arsenide, silicon carbide, mask plate, solar cell substrate, sapphire, lithium niobate, optical lens, disk, optical disc, medical glass substrate and other similar material wafers with high cleanliness.
Q:What are the power parameters?
A:
Electrical: 220V, 3KW. CDA: Phi10 gas pipe, pressure: 0.25-0.3Mpa, flow rate: 1L/min. DI: OD3/8 tube, pressure: 0.3-0.4Mpa, flow: 20-25L/min. Drainage: OD32mm(UPVC).
Q:Can the particle increment be customized?
A:
Yes, the particle increment is based on customer requirements.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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