Does the machine support customization?

Yes, we offer OEM and ODM services with flexible customization options.

What is the maximum substrate size supported?

The maximum substrate size is 610mm x 630mm (24' x 24').

Advanced Wafer Bonder with Innovative Optical Focus Technology

Name: Advanced Wafer Bonder with Innovative Optical Focus Technology
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2123036795

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Product Name

Direct Imaging Lithography

Application

Hard Board, Soft Board

Advantage

Factory Price

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

High Resolution Imaging: Advanced optical lens and auto-focus technology ensure precise line quality and alignment.

Wide Substrate Compatibility: Supports wafer sizes 100-300mm and PCB sizes up to 610x630mm with thickness 0.1-5.0mm.

Flexible Data Input: Compatible with Gerber274X, DXF, ODB++, and GDSII formats for versatile application.

Advanced Platform Tech: Utilizes advanced air float platform technology to handle uneven board thickness effectively.

Fast Processing Capacity: High throughput capacity of less than 42 seconds per piece for standard large substrates.

Comprehensive Warranty: Provides 12 months warranty with 24-hour online professional technical support.

OEM/ODM Customization: Offers flexible customization options including OEM and ODM services for specific needs.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.02h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the minimum order quantity?

The minimum order quantity is 1 Set.

Q:What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

Q:What is the lead time for production?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.