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Advanced Wafer Laser Marking Machine for Precision Engraving
US$500,000.00-800,000.00
1 Piece
Product profile
Customization
AvailableCertification
ISO9001, CCCProtection
Anti-staticModel NO.
HM-L100Installation
VerticalHousing
ABS and MetalProduct Name
Wafer Laser Marking Machine Engraving Equipment FaWafer Size
8 Inch and 12 InchOperate Model
AutomaticAccuracy
0.0005mmWave Length
532nmTransport Package
Complies with International Logistics StandardsSpecification
532nm wave lengthTrademark
HimalayaOrigin
ChinaProduction Capacity
50000Key features
Cost-Effective Green Laser: 532nm wavelength offers significantly lower cost and higher average power than UV lasers.
Dual CCD Positioning: Features double-sided positioning and automatic mapping file generation for irregular wafers.
Flexible Customization: Offers OEM, ODM, and flexible customization options for specific client needs.
ISO9001 & CCC Certified: Equipment meets international quality standards with ISO9001 and CCC certifications.
Stable Modular Design: International brand configuration ensures stable operation and anti-static protection.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.09h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:Which wafer sizes are compatible with this equipment?
A:
The machine is suitable for marking both 8-inch and 12-inch wafers.
Q:What is the difference between this green laser and UV laser?
A:
The 532nm green laser has a significantly lower cost and higher average power compared to UV lasers, resulting in faster cutting efficiency.
Q:Does the machine support OEM and ODM services?
A:
Yes, we provide OEM, ODM, and flexible customization options to meet specific customer requirements.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the lead times for production?
A:
During peak season, the lead time is 3-6 months, while off-season lead time is 1-3 months.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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