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Advanced Wafer Transfer System for Optimal Production Efficiency
US$50,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursFunction
Abrasion Resistance, Lubrication, High Temperature ResistanceModel NO.
RB100Demoulding
Pull CoreCondition
NewCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsControl Mode
Point to Point ControlDrive Mode
ElectricLoad Capacity
100 KgSafety Features
Collision Avoidance SystemType
Shuttle SystemTransport Package
Wooden PackageSpecification
30KGTrademark
HimalayaOrigin
ChinaHS Code
8479501000Production Capacity
350Key features
SEMI S2 Certified: Certified by SEMI S2 for semiconductor industry safety standards.
Multi-Configuration Options: Available in single-arm, dual-arm with flip, and waterproof models.
Versatile Wafer Handling: Transfers wafers up to 300mm of various materials and thicknesses.
Advanced Trajectory Control: Capable of end-of-arm free trajectory and oblique insertion functions.
High Mould Life: Designed for 300,000 to 1,000,000 shots durability.
Comprehensive Warranty: Includes a 12-month warranty with 24-hour online technical support.
OEM/ODM Services: Offers flexible customization, OEM, ODM, and designing services.
High Load Capacity: Supports up to 100 Kg load capacity with collision avoidance.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What wafer sizes does the RB100 series support?
A:
The system is suitable for transferring wafers up to 300mm in size.
Q:What certifications does the product have?
A:
The product has been certified by SEMI S2 and holds ISO and CE certifications.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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