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Advanced X-ray Inspection Systems for Electronic Components Quality
US$50,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableCertification
ISO9001, CCCProtection
Anti-staticModel NO.
INP-01Installation
VerticalHousing
ABS and MetalProduct Name
Imaging X-ray EquipmentTube Current
2.5mALight Tube Power
400WDetail Resolution
0.4-0.8mmTube Voltage
90-130 KvFocal Spot Size
5-15 UmEquipment Dimensions
1700 (W) × 1450 (D) × 2000 (HTotal Power Consumption
4 KwEquipment Weight
2800 KgTransport Package
Complies with International Logistics StandardsSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
50000Key features
Dual Inspection Modes: Supports both 2D and 2.5D imaging with CT scanning for versatile layered analysis.
AI-Driven Defect Recognition: Automated Defect Recognition (ADR) with AI analysis for rapid and accurate flaw identification.
High-Throughput Inspection: Enables both inline and offline modes for efficient high-volume production testing.
Lifetime Warranty Coverage: 1-year comprehensive warranty covering parts and labor, with optional extended plans.
Flexible Customization: OEM and ODM services available with flexible customization options for specific needs.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.95h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What types of products can this X-ray system inspect?
A:
It is designed for semiconductor chips, capacitors, resistors, lithium batteries, and PCBA/SMT components.
Q:Does the equipment support 3D imaging?
A:
Yes, it supports 2D and 2.5D imaging, including CT scanning for layered inspection and simulated 3D imaging.
Q:What is the warranty period for this machine?
A:
We provide a 1-year comprehensive warranty covering manufacturing defects, parts, and labor, with optional extensions.
Q:Is customization available for this equipment?
A:
Yes, OEM and ODM services are available with flexible customization options to meet specific requirements.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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