High-Precision Automatic Wafer Dicing Machine for Silicon and GaAs

Name: High-Precision Automatic Wafer Dicing Machine for Silicon and GaAs
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2122846055

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$70,000.00-100,000.00

1 Set

Product profile

Customization

Available

After-sales Service

7*24 Hours

Function

High Temperature Resistance

Model NO.

WCE_01

Demoulding

Automatic

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

Product Name

Semiconductor Wafer Saw Machine

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

Max Effective Travel

310 mm

Feed Speed Range

0.1 to 1000 mm/S

Single Step Increment

0.0001 mm

Maximum Rotation Angle

380°

Spindle Speed Range

6,000 to 60,000 Rpm

Output Power

1.8 Kw (2.4 Kw Optional)

Transport Package

Customized or Wooden Box Packaging

Specification

1200mm × 1629mm × 1849mm

Trademark

Himalaya

Origin

China

Production Capacity

1111

Key features

Wide Application Range: Suitable for Silicon wafers, GaAs, GaN, Glass, SiC, PCB, QFN, DFN, and ceramics.

High Precision Control: Single step increment of 0.0001mm with reach accuracy of 0.003mm/310mm.

Customized Configuration: Flexible customization available according to specific customer needs.

High Rotation Capability: Maximum T axis rotation angle reaches 380 degrees for versatile processing.

High-Speed Spindle: Spindle speed range from 6,000 to 60,000 Rpm for efficient cutting.

Long Mould Life: Mould life exceeds 1,000,000 shots ensuring durability and cost-efficiency.

24/7 Technical Support: Professional online technical support available 24 hours a day, 7 days a week.

ISO Certified Quality: Product meets ISO certification standards for quality assurance.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.27h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.