Djj-120 Automatic Chamfering Machine for Semiconductor Wafer

Name: Djj-120 Automatic Chamfering Machine for Semiconductor Wafer
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2111010555

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provide

Warranty

12 Months

Model NO.

DJJ-120

Product Name

Automatic Chamfering Machine

Function

for Semiconductor Wafer

Certification

ISO

Condition

New

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Sub-micron Precision: Achieves sub-micron level edge uniformity for advanced semiconductor applications.

Minimal Material Loss: Optimized for minimal kerf loss with a material loss rate of less than 0.1%.

Multi-Material Support: Processes Si, GaAs, SiC, Sapphire, InP, and glass wafers up to 8 inches.

Full CNC Automation: Features full CNC control with optional robotic wafer handling for stability.

SEMI Compliance: Meets SEMI/SECS/GEM standards for seamless fab integration.

Flexible Customization: Offers flexible customization options for specific machine functions.

Compact Design: Compact footprint of 2.2m x 1.5m x 2.2m suitable for cleanroom environments.

Integrated Cooling: Includes integrated DI water/spray cooling to prevent thermal stress.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.