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Expert PCB Assembly and Cutting Services for Electronics
US$100,000.00-1,500,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Yes

Condition

New

Model NO.

HM001

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Cutting

Upper milling cutter

Cutting Range

350 × 350 mm

Cutting Speed

1 to 100 mm/s

Repetition Accuracy

± 0.01 mm

Drive Type

AC Servo motor

Laser Height Accuracy

± 0.05 mm

Visual Accuracy

± 0.015 mm

Cutting Thickness

0.5 to 3 mm

Transport Package

Air Freight

Specification

1650× 1300× 1650mm

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

High Speed Performance: Cutting speed up to 100mm/s with spindle speed max 100,000 rpm.
Wide Application Range: Suitable for mobile phones, 5G devices, medical electronics, automotive, and large circuit boards.
Flexible Cutting Configurations: Available in offline and online modes with double stage and single spindle options.
Advanced Servo System: Powered by AC Servo motors from Panasonic or Nidec for stable operation.
Comprehensive Safety Features: Includes cutter breaking/sliding detection and diameter detection functions.
Robust Computer Control: Equipped with i7 processor, 16G RAM, and Windows 10 64-bit system.
Efficient Dust Collection: Up to 5HP dust collection system with multiple air outlet options.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
0/4000

Supplier replies will be sent to your registered email

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