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High Efficiency Automatic PCB and PCBA Manufacturing Machine
US$100,000.00-1,500,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Yes

Condition

New

Model NO.

HM001

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Cutting Range

350×350mm

Cutting Speed

1~100 mm/S

Repetition Accuracy

± 0.01 mm

Loading Mode

Belt / Module

Type of Drive

AC Servo Motor

Cutting Accuracy

± 0.1mm

Login Permission Control

Three-Level Authority

Max Axis Speed

Xy-Axis1000mm/S; Z-Axis250mm/S

Laser Height Accuracy

± 0.05mm

Transport Package

Air Freight

Specification

1650× 1300× 1650 mm

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

High Speed Performance: Cutting speed up to 100 mm/s with max axis speed of 1000 mm/s for efficient production.
Wide Application Scope: Suitable for mobile phones, 5G devices, medical electronics, automotive electronics, and large circuit boards.
Flexible Loading Options: Supports Belt/Module loading with optional Left/Right in and Once/Multiple loading modes.
Advanced Servo System: Equipped with Panasonic/Nidec AC Servo motors and HIWIN/TBI screw guides for stability.
Comprehensive Safety Features: Includes cutter breaking/sliding detection and three-level login permission control.
Robust Computer System: Powered by i7 processor, 16G RAM, and Windows 10 64Bit for reliable operation.
Customizable Configurations: Offers flexible customization for cutting modes, loading, and optional MES/Code scanning functions.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.13h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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