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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
US$100,000.00-1,000,000.00
1 Set

Product profile

Customization

Available

After-sales Service

7*24 Hours

Function

High Temperature Resistance

Model NO.

Himalaya-26

Demoulding

Automatic

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

X-Y Table

105×105mm Stroke

Z-Axis

120° Rotation

Splitting Yield

≥99.5%

Equipment Uptime

≥95%

Mean Repair Time

≤12 Hours

Machine Dimensions

1650×1200×1700mm (W×D×H)

Power Supply

220V, 50Hz, 10A

Alignment

CCD Auto-Alignment

Transport Package

Crate

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

22222

Key features

CCD Auto-Alignment: Ensures precise positioning with edge detection accuracy of <2mm radius.
Unmanned Production: Supports unmanned operation with only intermittent manual loading.
Multi-Material Support: Processes 2-8 inch LED, SiC, glass, and ceramic wafers.
Flexible Customization: Offers flexible customization for chip size and visual hardware.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for production?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

Send Inquiry

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