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High-Performance Semiconductor Debonding Tools for Efficient Supply Chains
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Demoulding

Pull Core

Model NO.

SDM-01

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Product Name

IC Lamination Machine

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Omron PLC Control: Equipped with Omron PLC for precise automation and repeatability.
High Precision Performance: Uses imported materials and advanced equipment for stable, high-precision operation.
Comprehensive Safety: Features double switch, emergency stop, light curtain, and safety door protection.
ISO Certified Quality: Manufactured under ISO certification standards ensuring guaranteed quality.
Versatile Compatibility: Compatible with all package types including QFN, BGA, SOP, and QFP.
Long Service Life: Strong wear resistance with a mould life of 300,000-1,000,000 shots.
Flexible Customization: Customized according to needs with OEM/ODM services provided.
12-Month Warranty: Includes a 12-month warranty with 24-hour online technical support.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.72h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for production?
A:
Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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