High-Performance Vacuum Oven for Semiconductor Testing and Development

Name: High-Performance Vacuum Oven for Semiconductor Testing and Development
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2111350255

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$50,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Function

Anti-Corrosion, Anti-Cold

Model NO.

MOLZK-32D1

Demoulding

Automatic

Condition

New

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

>1,000,000 Shots

Product Name

Vacuum High Temperature Oxygen Free Oven

Application

Scientific Research and Production Units

Feature 1

Fast Heating

Feature 2

Energy Saving

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Energy Saving Design: Saves 30LPM nitrogen with fast heating and unique airflow system.

Class 100 Cleanliness: Ensures cleanliness with metal filters for high-precision components.

Versatile Semiconductor Use: Ideal for BPO/PI glue curing, IC wafers, MEMS, and FPD drying.

Comprehensive Warranty: 12-month warranty with 24-hour online professional technical support.

Flexible Customization: OEM/ODM services available with flexible customization options.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.49h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.

Q:What is the minimum order quantity?

The minimum order quantity is 1 Set.

Q:What are the payment terms?

Payment terms include LC, T/T, PayPal, and Western Union.