What customization options are available?

We offer flexible customization including OEM, ODM, and designing services with options for control mode, drive mode, and safety features.

What is the minimum order quantity?

The minimum order quantity is 1 Set.

What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.

High-Performance Wafer Transfer System for Enhanced Production Efficiency

Name: High-Performance Wafer Transfer System for Enhanced Production Efficiency
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2085999092

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$50,000.00-70,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Function

Abrasion Resistance, Lubrication, High Temperature Resistance

Model NO.

RB100

Demoulding

Pull Core

Condition

New

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Control Mode

Point to Point Control

Drive Mode

Electric

Load Capacity

100 Kg

Safety Features

Collision Avoidance System

Type

Shuttle System

Transport Package

Wooden Package

Specification

30KG

Trademark

Himalaya

Origin

China

HS Code

8479501000

Production Capacity

350

Key features

SEMI S2 Certified: Certified by SEMI S2 for semiconductor industry safety standards.

Multi-Configuration Options: Available in single-arm, dual-arm with flip, and waterproof models.

Versatile Wafer Handling: Transfers wafers up to 300mm of various materials and thicknesses.

Advanced Trajectory Control: Capable of end-of-arm free trajectory and oblique insertion functions.

High Mould Life: Designed for 300,000 to 1,000,000 shots durability.

Comprehensive Warranty: Includes a 12-month warranty with 24-hour online technical support.

OEM/ODM Services: Offers flexible customization, OEM, ODM, and designing services.

High Load Capacity: Supports up to 100 Kg load capacity with collision avoidance.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.77h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.

Q:What wafer sizes does the RB100 series support?

The system is suitable for transferring wafers up to 300mm in size.

Q:What certifications does the product have?

The product has been certified by SEMI S2 and holds ISO and CE certifications.