Powered by Made-in-China.com
High Precision 15W UV Laser Dicing Machine for Wafer Cutting
US$10,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingWarranty
12 MonthsModel NO.
WD-01230Laser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
UV LaserLaser Classification
Semiconductor LaserType
Semiconductor Laser Marking MachineMarking Method
Mask Pattern MarkingLaser Source
DPSS UV Laser (355nm)Laser Power
20/25/30W NanosecondProcessing Area
300 × 400mm (Xy Travel)Positioning Accuracy
±1umRepeat Accuracy
±0.02mmVision Ystem
5MP Camera (2592×1944)Cutting Speed
up to 250mm/SCutting Accuracy
<30μmTransport Package
Customized or Wooden Box PackagingSpecification
1400*650*1450 mmTrademark
HimalayaOrigin
ChinaProduction Capacity
50000Key features
High-Precision UV Laser: 15W DPSS UV laser (355nm) enables precise cold processing with minimal thermal impact.
Integrated Vision System: 5MP coaxial camera allows for precise alignment, edge finding, and real-time inspection.
Thermal Stability Design: Marble gantry and table provide superior thermal and vibrational stability for consistent results.
Customizable Configuration: Flexible customization available for laser power, processing area, and fixture requirements.
Self-Developed Software: Proprietary control software tailored specifically for wafer dicing applications and automation.
Versatile Material Support: Ideal for brittle and heat-sensitive materials like Si, SiC, GaN, glass, and ceramics.
Comprehensive Package: Includes purification unit, gas interface, water cooling, and safety interlocks for immediate use.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.58h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What types of materials can this UV laser wafer dicing machine process?
A:
The machine is specifically designed for processing brittle and heat-sensitive materials, including silicon wafers, SiC (silicon carbide), gallium nitride (GaN), glass, ceramics, and other semiconductor substrates. The 355nm UV laser ensures minimal thermal impact and high-quality cuts.
Q:What is the maximum wafer size supported by this system?
A:
The standard configuration supports wafers up to 6 inches (150mm). Customizable options are available for larger wafer sizes or specific fixture requirements.
Q:How does the UV laser achieve better cutting quality compared to traditional methods?
A:
The UV laser's short wavelength allows for extremely fine focusing and high peak power, resulting in a 'cold processing' effect that reduces heat-affected zones (HAZ), prevents material cracking, and delivers smooth, burr-free edges.
Q:What is the warranty period for this machine?
A:
We provide a 12-month warranty for this UV laser wafer dicing machine.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
9060 High Precision CO2 Laser Engraver Cutting Machine for Push Button Control
US$1,700.00
1 sets(MOQ)
UV Laser Marking Engraving Machine High Precision Coding Equipment for Plastic Glass Metal Packaging
US$5,100.00-5,500.00
1 Piece(MOQ)
Right G400h Automatic Laser Marking Machine High Precision for SMT PCB Marking
US$29,990.00-35,000.00
1 Piece(MOQ)
Top Quality UV Laser Marking Machine with High Precision 3W-15W
US$2,050.00-9,950.00
1 Piece(MOQ)
UV Laser Marking Machine for High Speed Cable Food Package
US$4,100.00-5,400.00
1 Piece(MOQ)
High Speed Automatic 5W Fly UV Laser Marking Printing Machine for Mask, Plastic Metal with CE Certification Printer
US$6,650.00-7,600.00
1 Piece(MOQ)
Inte Laser Marking Machine for FPC/PCB Offering High Precision and Reliability
US$52,000.00-58,000.00
1 Piece(MOQ)
High Precision UV Laser Marking Machine for Plastic Glass
US$15,000.00-29,999.00
1 Piece(MOQ)
High Speed High Quality Laser Marking Machine for Efficient Cutting Operations
US$52,000.00-58,000.00
1 Piece(MOQ)
High Quality Laser Marking Machine with Precision Accuracy for High Demand
US$52,000.00-58,000.00
1 Piece(MOQ)
High Precision UV Laser Marking Machine for Jewelry Engraving
US$2,099.00-2,143.00
1 set(MOQ)
High-Precision UV Laser Marking Machine for Durable Materials
US$4,600.00
1 Piece(MOQ)
High-Precision UV Laser Engraving Machine for Glass and Plastic
US$2,275.00-2,927.00
1 Piece(MOQ)
High-Precision CO2 Laser Marking Machine for Industrial Applications
US$7,000.00-20,000.00
1 Piece(MOQ)
High-Precision 5W UV Laser Marking Machine for Durable Engravings
US$4,980.00-5,380.00
1 Set(MOQ)
High Speed 5W UV Laser Coding Machine White Cables Laser Inkjet Printer Jpt Laser Source for Extruded Pipe Industry
US$3,500.00-5,000.00
1 Piece(MOQ)
High Precision UV Laser Marking Machine for Eyelash Branding
US$4,500.00
1 Piece(MOQ)