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High-Precision 30W Picosecond Laser Cutter for Sapphire Glass Processing
US$50,000.00-70,000.00
1 Piece
Sample price:US$55000.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursWarranty
12 MonthsModel NO.
PML-01Application
Automotive Industry, SemiconductorCooling System
Water CoolingTechnical Class
Pulse LaserApplicable Material
NonmetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingLaser Power
10W, 15W, 20W, 30WProcessing Area
600*500mmLaser Wavelength
355nmGalvo Scanning Range
50*50mmOutput Pulse Width
≤15PSCutting Line Width
Less Than 20umComprehensive Processing Precision
±30umRepeat Precision
X/Y: ±1umPositioning Precision
X/Y: ±3umPower Requirement
380V/50 - 60HzTransport Package
Wooden PackSpecification
1770*1670*1860mmTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Cold Ablation Technology: UV picosecond laser eliminates heat transfer, preventing burning, melting, and carbonization for burr-free edges.
Fully Automated Workflow: One-button operation handles feeding, vision alignment, cutting, counting, and unloading for hands-free production.
Dual-Station Continuous Production: Roll-to-sheet design allows simultaneous cutting and loading/unloading, enabling 24/7 continuous operation.
High-Precision Motion Control: Imported linear motors with 1G acceleration and full-closed loop encoders ensure micron-level positioning accuracy.
Marble Base Stability: Massive marble platform provides superior rigidity, thermal stability, and vibration damping for consistent results.
Advanced CCD Vision System: Automatically scans and compensates for fiducial marks to ensure perfect cut placement and alignment.
Multi-Process Integration: Replaces four traditional steps (blanking, drilling, shaping, punching) in a single automated platform.
Customizable Laser Power: Available in 10W, 15W, 20W, and 30W options to suit different material thicknesses and throughput needs.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.16h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How does the UV picosecond laser prevent heat damage?
A:
It uses a 'cold ablation' process where ultraviolet wavelength and ultrashort pulses break molecular bonds directly, vaporizing material without transferring heat to prevent burning or melting.
Q:What does 'fully automated' and 'one-button operation' mean?
A:
After initial setup, the machine autonomously handles feeding, vision alignment, cutting, counting, and unloading, maximizing uptime and reducing labor costs.
Q:Can this machine replace four traditional processes?
A:
Yes, it integrates blanking, drilling, shaping, and punching into one automated platform, simplifying production and improving yield.
Q:How does the dual-station design improve efficiency?
A:
It allows one station to cut while the other is loaded/unloaded, enabling truly continuous 24/7 production and increasing overall throughput.
Q:How do I choose the right laser power?
A:
10W/15W is for thin delicate films; 20W is versatile for standard FPC/PCB; 30W is best for thicker materials or maximum throughput.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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