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80W Mopa Laser Scribing Equipment for High Precision Wafer Processing
US$70,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursWarranty
12 MonthsModel NO.
LPM-01Customized
Non-CustomizedStandard Modular Design
Standard Modular DesignCooling System
Air CoolingApplicable Material
NonmetalTechnical Class
Pulse LaserType
Semiconductor LaserLaser Power
80W MopaLaser Wavelength
1064 NmMax. Scribing Speed
600 mm/SLine Width
< 40 UmScribing Depth
0 - 200 UmScribing Accuracy
+/- 0.1 mmPositioning System
CCD Vision SystemCompatible Wafer Size
156 * 156 mm to 168 * 168 mmEquipment Weight
1200 KgTransport Package
CrateSpecification
12, 140 * 1, 440 * 1, 800 mmTrademark
HimalayaOrigin
ChinaProduction Capacity
1000Key features
High Throughput Performance: Achieves 3,200 wafers per hour with less than 1% breakage rate for Grade A+ wafers.
Precision CCD Vision System: Enables high-precision alignment critical for thin and fragile wafer processing.
Advanced MOPA Laser Source: Allows independent control of pulse parameters for optimal scribing quality on brittle silicon.
Minimal Heat Affected Zone: Non-contact process ensures HAZ less than 80 micrometers for superior edge quality.
Comprehensive Warranty: Provides 12 months warranty coverage for all mechanical defects.
24/7 Technical Support: Engineers available around the clock for immediate assistance and troubleshooting.
Flexible Customization: Offers flexible customization options to meet specific production requirements.
ISO 9001 Certified Quality: Manufacturing process certified for international standards of reliability and performance.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.78h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the maximum scribing speed of the machine?
A:
The machine features a maximum scribing speed of 600 mm/s.
Q:What wafer sizes are compatible with this equipment?
A:
It is compatible with wafer sizes ranging from 156*156 mm to 168*168 mm.
Q:Does the machine support customization?
A:
Yes, flexible customization options are available to suit specific needs.
Q:What is the lead time for orders?
A:
Lead time is 1-3 months during off-peak season and 3-6 months during peak season.
Q:What payment terms are accepted?
A:
We accept LC, T/T, PayPal, and Western Union as payment methods.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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