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High-Precision Fiber Laser Cutter for Metal Fabrication Projects
Negotiable
1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Warranty

12 Months

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Metal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Model

Pcf0606-L-a

Weight

1800kg

Transport Package

Customized or Wooden Box Packaging

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Dual Linear Motor Drive: Gantry structure with 1.5G max acceleration for high efficiency and curve processing.
Versatile Cutting Functions: Supports flat sheet, coil-flat sheet, piercing, engraving, and sharp corner smoothing.
Energy Efficient Laser: Photoelectric conversion rate over 30% with low running costs and stable output.
Compact Integrated Design: Rational layout saves plant land while maintaining high precision and stability.
Wide Material Compatibility: Cuts stainless steel, aluminum, titanium, galvanized sheet, brass, and other metals.
Flexible Customization: OEM/ODM services available with flexible customization options for specific needs.
Professional Support: 24-hour online technical support and comprehensive after-sales service included.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM Designing.
Q:What is the maximum cutting thickness?
A:
The machine can cut materials with a thickness of up to 2mm.
Q:What is the laser power range?
A:
The laser power ranges from 500W to 1500W.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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