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High-Precision Green Laser Dual Platform Cutting and Engraving Machine
US$10,000.00-200,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Yes

Warranty

12 Months

Model NO.

HM001

Laser Visibility

Invisible

Applicable Material

Metal

Cooling System

Air Cooling

Laser Wavelength

Fiber Laser

Laser Classification

Fiber Laser

Type

YAG Laser Marking Machine

Transport Package

Air Freight

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Picosecond Green Laser: High-precision processing with invisible laser visibility for delicate materials.
Dual Platform Design: Improves efficiency with automatic target finding and expansion compensation.
Customizable Processing Area: Standard 250mmx500mm with flexible customization options available.
12 Months Warranty: Comprehensive coverage with 24-hour online technical support included.
OEM and ODM Services: Flexible customization and manufacturing services available for clients.
Air Cooling System: Efficient cooling for stable operation in various environmental conditions.
Optional Auto Loading: Supports optional automatic loading and unloading methods for automation.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.68h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the processing area size?
A:
The standard processing area is 250mmx500mm, which can be customized.
Q:Is customization available?
A:
Yes, we offer flexible customization options including OEM and ODM services.
Q:What is the lead time for orders?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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