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High-Precision Green Laser Engraver for Creative Custom Designs
US$7,000.00-20,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
HDZ-FPC4530DLaser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
UV Laser, CO2 LaserLaser Classification
Semiconductor LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingProduct Name
PCBA & IC & Wafer Marking MachineFeature 1
High PrecisionFeature 2
High EfficiencyAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Automatic Processing: Features automatic loading/unloading, positioning, code reading, and double vehicle processing for efficiency.
Versatile Material Support: Suitable for copper foil, FPC, PI, CVL, and barcodes with substrate thickness from 0.036mm to 1.6mm.
System Integration: Can be connected to MES, IMS, PMS, and ERP systems for seamless production line integration.
Flexible Cooling Options: Supports both air cooling and water cooling modes to adapt to different operational needs.
OEM/ODM Service: Provides OEM, ODM, and designing services to meet specific customer requirements.
Wide Application Scope: Ideal for mobile digital products, wearable devices, and automotive electronics marking.
Professional Support: Offers 24 hours online professional technical support alongside a one-year warranty.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What materials can be marked?
A:
It applies to copper foil, FPC steel sheet, PI, CVL, barcode, QR code, and characters of FPC soft board.
Q:What is the laser range?
A:
The range of laser is BOX 50mm*50mm.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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