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High-Precision Laser Cutter for Thin Metal Fabrication Solutions
US$200,000.00-300,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
MPS-0606LMApplication
Home Appliance, Environmental Equipment, Automotive IndustryCooling System
Water CoolingTechnical Class
Continuous Wave LaserApplicable Material
MetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingReach Accuracy
+0.003mmMinimum Measurement
0.5*0.5mmCutting Substrate
Si, Pkg, PCB etcCentral System Function
Remove Machine Alarm ProcessingSpindle Output Power
1.8kw(2.4kw)Spindle Speed Range
6000-60000rpmPower
AC380V±10%Size
1200mm×1629mm×1849mmTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Precision Accuracy: Reach accuracy of +0.003mm with high-resolution grating rulers for superior processing efficiency.
Stable Marble Platform: Uses a stable Dinglongmen marble platform to ensure equipment stability and long-term performance.
Wide Spindle Speed Range: Spindle speed ranges from 6000 to 60000rpm with 1.8KW output power for versatile cutting needs.
User-Friendly Interface: Features real-time feedback and tactile control buttons for efficient workflow management.
Flexible Customization: Offers OEM/ODM services and flexible customization options for machine configurations.
Comprehensive Warranty: Provides a 12-month warranty with 24-hour online professional technical support.
High Cost-Effectiveness: Closed structure design ensures superior performance and stability at an extremely high cost-effectiveness.
Global Service Network: Exported to over 30 countries with a proven track record of serving 200+ customers and suppliers.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What materials can this laser cutter process?
A:
It is mainly used for cutting metal sheets, ceramic substrates, Si, Pkg, PCB, glass, and wafers.
Q:Is customization available for this machine?
A:
Yes, custom configurations are available upon request, including reach accuracy, cutting substrate, and spindle output power.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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