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Advanced Laser Drilling Machines for Zirconium and Alumina Precision
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Function

Lubrication, High Temperature Resistance

Model NO.

LDS-01

Demoulding

No

Condition

New

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Product Name

Ceramic Laser Drilling/Dicing

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Multi-Wavelength Laser: Supports 1064nm, 532nm, and 355nm wavelengths for versatile applications.
High Efficiency Output: Achieves UPH of 50+ plates per hour with stable high peak power fiber laser.
Patented Technology: Features laser waveform segmentation editing for stable and reliable performance.
Flexible Customization: Offers customized solutions according to specific needs and material requirements.
Comprehensive Certification: Certified with ISO and CE standards ensuring safety and quality compliance.
Versatile Applications: One machine handles drilling, cutting, and scribing for multiple material types.
Visual Positioning: Supports multi-feature CCD visual positioning for precise alignment and operation.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.07h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this machine process?
A:
It is designed for precision drilling, cutting, and scribing of alumina, aluminium nitride, zirconium oxide, silicon nitride, and other similar materials.
Q:What are the available laser wavelengths?
A:
The machine supports laser wavelengths of 1064nm, 532nm, and 355nm.
Q:What is the production capacity (UPH) of the machine?
A:
The machine achieves an output of 50 or more plates per hour.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
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