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Advanced Laser Drilling Machines for Zirconium and Alumina Precision
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedFunction
Lubrication, High Temperature ResistanceModel NO.
LDS-01Demoulding
NoCondition
NewCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsProduct Name
Ceramic Laser Drilling/DicingFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Multi-Wavelength Laser: Supports 1064nm, 532nm, and 355nm wavelengths for versatile applications.
High Efficiency Output: Achieves UPH of 50+ plates per hour with stable high peak power fiber laser.
Patented Technology: Features laser waveform segmentation editing for stable and reliable performance.
Flexible Customization: Offers customized solutions according to specific needs and material requirements.
Comprehensive Certification: Certified with ISO and CE standards ensuring safety and quality compliance.
Versatile Applications: One machine handles drilling, cutting, and scribing for multiple material types.
Visual Positioning: Supports multi-feature CCD visual positioning for precise alignment and operation.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.07h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this machine process?
A:
It is designed for precision drilling, cutting, and scribing of alumina, aluminium nitride, zirconium oxide, silicon nitride, and other similar materials.
Q:What are the available laser wavelengths?
A:
The machine supports laser wavelengths of 1064nm, 532nm, and 355nm.
Q:What is the production capacity (UPH) of the machine?
A:
The machine achieves an output of 50 or more plates per hour.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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