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High-Precision Laser Engraver for Custom Electronics and Parts
US$1,000.00-7,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
WMM-01Laser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
UV Laser, CO2 LaserLaser Classification
Semiconductor LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingProduct Name
PCBA & IC & Wafer Marking MachineFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Automated FPC Processing: Supports automatic loading, unloading, positioning, and code reading for stacked FPC.
Flexible Laser Options: Available with Green, UV, or Fiber laser types for diverse material marking needs.
System Integration Ready: Can be seamlessly connected to MES, IMS, PMS, and ERP systems for smart manufacturing.
Wide Material Compatibility: Suitable for copper foil, FPC, PI, CVL, and substrates with thickness 0.036mm-1.6mm.
Efficient Dual-Station Design: Features double vehicle processing with fast station switching for high efficiency.
Comprehensive Warranty: Provides a one-year warranty with 24-hour online professional technical support.
Customizable Solutions: Offers flexible customization and OEM/ODM services to meet specific production needs.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.13h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can be marked?
A:
It is applied to the marking of tracing information such as copper foil, FPC steel sheet, PI, CVL, barcode, QR code and characters of FPC soft board.
Q:What laser types are available?
A:
Available laser types include Green laser, UV laser, and fiber laser.
Q:Can the machine connect to ERP systems?
A:
Yes, it can be connected to MES, IMS, PMS, and ERP systems.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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