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High-Precision UV Laser Engraving Machine for Glass and Silica
US$1,000.00-7,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
EP-15-THG-Laser Visibility
VisibleApplicable Material
MetalCooling System
Water CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
Fiber LaserLaser Classification
Semiconductor LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingProduct Name
UV Laser MarkingFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Flexible Customization: Customized according to needs with OEM and ODM services available.
Versatile Material Marking: Suitable for glass, silica, metal, PCB, and various plastics like HDPE/PP.
Split-Type Design: Integrates easily into assembly lines or installs on lifting devices.
High Marking Speed: Processes up to 250 characters per second with 100x100mm scope.
Water Cooling System: Efficient water cooling ensures stable performance for continuous wave lasers.
Professional Support: 24-hour online technical support and one-year warranty coverage.
Compact Dimensions: Overall size 600x800x1350mm, suitable for various industrial spaces.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.67h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this machine mark?
A:
It is applicable for glass, silica, metal, PCB, and packaging materials like HDPE, PO, and PP.
Q:What is the marking speed and scope?
A:
The marking speed is 250 characters/sec with a marking scope of 100*100mm.
Q:Is customization available?
A:
Yes, we offer customized solutions according to needs, including OEM and ODM services.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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