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High-Precision UV Laser Engraving Machine for Glass and Silica
US$1,000.00-7,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

Provided

Model NO.

EP-15-THG-

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Water Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

Fiber Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Product Name

UV Laser Marking

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Flexible Customization: Customized according to needs with OEM and ODM services available.
Versatile Material Marking: Suitable for glass, silica, metal, PCB, and various plastics like HDPE/PP.
Split-Type Design: Integrates easily into assembly lines or installs on lifting devices.
High Marking Speed: Processes up to 250 characters per second with 100x100mm scope.
Water Cooling System: Efficient water cooling ensures stable performance for continuous wave lasers.
Professional Support: 24-hour online technical support and one-year warranty coverage.
Compact Dimensions: Overall size 600x800x1350mm, suitable for various industrial spaces.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.67h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What materials can this machine mark?
A:
It is applicable for glass, silica, metal, PCB, and packaging materials like HDPE, PO, and PP.
Q:What is the marking speed and scope?
A:
The marking speed is 250 characters/sec with a marking scope of 100*100mm.
Q:Is customization available?
A:
Yes, we offer customized solutions according to needs, including OEM and ODM services.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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