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High-Precision UV Laser Marking System for PCB Components
US$1,000.00-7,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
ProvidedModel NO.
PCBA-01Laser Visibility
VisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
UV Laser, CO2 LaserLaser Classification
Semiconductor LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingProduct Name
PCBA & IC & Wafer Marking MachineFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Multi-Laser Source Options: Supports green, UV, and CO2 laser sources to meet diverse marking needs.
High-Speed Automatic Marking: Fully automatic loading/unloading with a speed of 1200 pieces per hour.
Precision Vision System: Intelligent vision system ensures direction inspection and sampling quality control.
Integrated Fume Removal: Special device quickly extracts fumes and dust to protect the working environment.
Wide Material Applicability: Suitable for marking packaged ICs including DIP, QFN, and BGA types.
Flexible Customization: Customized according to specific needs for product name and features.
CE and SEMI Compliance: Equipment complies with CE MARK and SEMI standards for safety and quality.
Professional Technical Support: 24-hour online professional technical support provided for all equipment.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.58h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What laser sources are available?
A:
The system supports imported double-head 20W fiber laser, and green, UV, and CO2 laser sources are optional.
Q:What is the marking speed?
A:
The marking speed is 1200 pieces per hour when idle.
Q:Is the machine fully automatic?
A:
Yes, it features fully-automatic loading and unloading from hanging basket to hanging basket.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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