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High Precision Wafer Grinding Machine for Enhanced Performance
US$10,000.00-50,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceWarranty
1 YearModel NO.
WTGM-300Application
Automotive IndustryTechnical Class
Continuous Wave LaserControl
AutomaticPower Density
Deep Fusion WeldingLaser Classification
Semiconductor LaserType
Silicon Steel Sheet Laser Welding MachineApplicable Material Attributes
Metals and Alloys Ceramics Oxides Carbides GlassCapability
Fully Automatic Precision Grinding CapabilityDual Workpiece Fixing Methods
Vacuum Suction CupContrary Motion Design
Workpiece Rotates in The Opposite DirectionGrinding
Low Grinding ResistanceTransport Package
Air FreightSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
20Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.68h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
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Jiangsu Himalaya Semiconductor Co., Ltd.
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