Powered by Made-in-China.com
High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
CBM-01Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Speed Performance: Processes up to 20 clips per cycle with ultra-high speed chip mounting.
Customizable Configuration: Flexible customization available to meet various market and special demands.
Advanced Dispensing Control: Multi-dispensing independent control with glue detection and automatic filling.
Vacuum Reflow Capability: Stepwise vacuum design with up to 5 steps and intelligent nitrogen monitoring.
Comprehensive Inspection: Includes solder patch inspection, solder paste inspection, and 100% finished product checks.
ISO Certified Quality: Equipment meets ISO certification standards for reliability and quality.
Global Export Experience: Exported to over 30 countries with over 200 customers and suppliers.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.67h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
Payment terms include LC, T/T, PayPal, and Western Union.
Q:What is the lead time for delivery?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Right Wj22 Wafer Die Bonder Zhengshi Fully Automatic High Precision Wafer Die Bonding Equipment for Semiconductor Manufacturing
US$20,000.00-30,000.00
1 Piece(MOQ)
High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
US$10,000.00-100,000.00
1 Piece(MOQ)
Semiconductor Equipment Wafer Loading and Unloading Wafer Mounter Dicing Turret Handler
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Quality Semiconductor Combining Precision and Speed Asm Ms90 Asmpt Wafer Chip Sorter Sorting Equipment
US$127,000.00-191,500.00
1 Piece(MOQ)
Semiconductor High Speed and High Precision 3D Aoi Leadscan Equipment Ky
US$125,000.00
1 Piece(MOQ)
Custom High Precision K&S Bonding Equipment for Semi Conductor
US$2,100.00-2,500.00
1 Piece(MOQ)
Flip Chip Bonder Semiconductor Equipment Small Desktop China Manufaturer
US$90,500.00-119,000.00
1 Piece(MOQ)
High Speed Gkg Gd80+P Die Bonding Equipment with Multi-Adhesive Dispensing for Semiconductor Production
US$12,500.00-38,000.00
1 Piece(MOQ)
High Precision K&S Bonding Equipment for Semiconductor Line
US$2,100.00-2,500.00
1 Piece(MOQ)
High Speed Hybrid SMT Pick and Place Mounter Hanwha Samsung Npm-D3a Intelligent SMD Placement Equipment
US$5,000.00-8,000.00
1 Set(MOQ)
Juki Rx-8 Advanced High-Speed Newest for SMT Pick and Place Equipment
US$70,000.00
1 Piece(MOQ)
High Speed Hybrid SMT Pick and Place Mounter Hanwha Samsung Npm-D3a Intelligent SMD Placement Equipment
US$5,000.00-8,000.00
1 Set(MOQ)
Ruibo Small Type High-Speed Tube Pakage IC Programming Equipment/Semiconductor
US$2,100.00-3,800.00
1 Set(MOQ)
Pemtron Zeus Series 3D Aoi Equipment, High Precision Inline Optical Tester for Advanced Semiconductor IC Packaging
US$42,000.00-42,800.00
1 Piece(MOQ)
Gkg Gd602D Industrial High Speed Automatic Die Bonding Equipment with Cross Bonding
US$32,500.00-58,000.00
1 Piece(MOQ)
OEM Custom K&S Bonding Inspector Parts for Semiconductor Equipment
US$2,100.00-2,500.00
1 Piece(MOQ)
Juki Rx-8 High-Speed Newest for SMT Pick and Place Equipment
US$82,500.00
1 Piece(MOQ)
Juki Ke2070 High Speed Universal SMT Production Equipment
US$14,600.00-31,000.00
1 Piece(MOQ)
Juki Lx-8 High-Speed Flexibility Low-Cost Pick and Place Manufacturers Equipment.
Negotiable
1 Piece(MOQ)
Cheap Used SMT Pick and Place Machine High Speed Feeders Chip Mounter Dual Arms PCB Placing Machine PCBA Surface Mounter Equipment
US$30,000.00-105,000.00
1 set(MOQ)