Is customization available?

Yes, flexible customization is available to meet special demands and various market requirements.

What after-sales service is provided?

We provide 24 hours online professional technical support and a 12-month warranty.

High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment

Name: High-Speed Clip Bonder Wafer Semiconductor Packaging and Bonding Placement Equipment
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2126263785

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Condition

New

Model NO.

CBM-01

Speed

High Speed

Precision

High Precision

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Semiconductor Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

After-Sale Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

High Speed Performance: Processes up to 20 clips per cycle with ultra-high speed chip mounting.

Customizable Configuration: Flexible customization available to meet various market and special demands.

Advanced Dispensing Control: Multi-dispensing independent control with glue detection and automatic filling.

Vacuum Reflow Capability: Stepwise vacuum design with up to 5 steps and intelligent nitrogen monitoring.

Comprehensive Inspection: Includes solder patch inspection, solder paste inspection, and 100% finished product checks.

ISO Certified Quality: Equipment meets ISO certification standards for reliability and quality.

Global Export Experience: Exported to over 30 countries with over 200 customers and suppliers.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.95h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the minimum order quantity?

The minimum order quantity is 1 set.

Q:What are the payment terms?

Payment terms include LC, T/T, PayPal, and Western Union.

Q:What is the lead time for delivery?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.