What is the machine weight?

The machine weighs approximately 660 kg.

Are OEM and ODM services available?

Yes, OEM and ODM services are available with flexible customization options.

Higher Accuracy Wire Bonding/Welding Machine for Sot, Sop, Qfp, DIP, BGA, COB

Name: Higher Accuracy Wire Bonding/Welding Machine for Sot, Sop, Qfp, DIP, BGA, COB
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2126935785

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$60,000.00-120,000.00

1 Set

Product profile

Customization

Available

Function

High Temperature Resistance

Demoulding

Pull Core

Model NO.

WBM-01

Condition

New

Certification

CCC, PSE, FDA, RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Pneumatic

Mould Life

>1,000,000 Shots

Applicable Wire Diameter

φ15 ~ φ50μm (Gold or Copper)

Maximum Bonding Area

X: 56mm, Y: 80mm

Repeatability

±3μm (@ 3-Sigma)

Position Accuracy

±3μm (@ 3-Sigma)

Applicable IC Products

to, Sot, Sop, Ssop, Tssop, Solc, Qfp, DIP, BGA,

Magazine Compatibility

Length: 100 to 275 mm Width: 30 to 90mm

Weight

660kg

Bonding Cycle

45 Ms Per Wire

Transport Package

International Trade Standard

Specification

985mm*960mm*1770mm

Trademark

Himalaya

Origin

China

HS Code

8486402200

Production Capacity

100

Key features

High-Speed Automatic Bonding: 45 ms per wire cycle with new servo system for faster response and higher UPH.

Advanced Optical System: New zoom lens provides wider range, clearer images, and higher structural stiffness.

Intelligent Force Control: Stable binding force with advanced calibration and intelligent detection prompts.

Comprehensive Inspection: High Precision Post Weld Inspection (PBI) ensures quality and consistency.

Proprietary Technology: Core components and drive systems feature independent intellectual property.

Flexible Customization: OEM and ODM services available with flexible customization options.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the bonding cycle time?

The machine achieves a bonding cycle of 45 ms per wire.

Q:What is the maximum bonding area?

The maximum bonding area is X: 56mm and Y: 80mm.

Q:What IC packages are compatible?

Compatible with TO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, and optocouplers.