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Industrial Wafer Marking Machine for High Speed 1d and 2D Code Marking
US$20,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
ME-01Laser Visibility
VisibleApplicable Material
NonmetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
CO2 LaserLaser Classification
Semiconductor LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingProduct Name
Fully Automatic Wafer ID Marking EquipmentFeature 1
High PrecisionFeature 2
High EfficiencyAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Fully Automatic Operation: Features DD motor dual-arm robot, automatic visual positioning, and marking content verification.
Wide Material Compatibility: Supports Si, SiC, InP, GaN, Sapphire, Glass, and LT wafers of 2-12 inch sizes.
Flexible Customization: OEM/ODM services available with flexible customization options for specific needs.
Industry Standard Compliance: Compliant with SEMI S2/S8 standards and supports SECS/GEM protocol for fab integration.
Comprehensive Warranty: Provides a one-year warranty with 24-hour online professional technical support.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What materials can this machine mark?
A:
It is suitable for marking on Si, SiC, InP, GaSb, GaN, Sapphire, Glass, and LT wafer substrates.
Q:What wafer sizes are supported?
A:
The equipment supports 2-6 inch, 4-8 inch, and 8-12 inch wafer sizes.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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