Precision Eutectic Die Bonder for Enhanced Chip Assembly

Name: Precision Eutectic Die Bonder for Enhanced Chip Assembly
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2073765332

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$18,000.00-200,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Function

High Temperature Resistance

Model NO.

HMLA-LS03

Demoulding

Automatic

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Chip Size

≤1.5mm

Substrate Size

0.15 to 4mm

Velocity

70s

Patch Pressure

10g to 100g

Xy Placement Accuracy

+/- 1.5um

Die Rotation Accuracy

0.3deg @3sigma

Fov

4X Lens

Heating Method

Pulse Heating

Temp. Accuracy

+/- 5 Deg

Transport Package

Air Freight

Specification

0*0*0

Trademark

Himalaya

Origin

China

Key features

Automatic Demoulding: Features automatic demoulding function for efficient assembly.

ISO Certified: Product meets ISO certification standards for quality assurance.

High Precision Placement: XY placement accuracy of +/- 1.5um@3sigma for small chips.

Flexible Customization: Supports flexible customization for chip and substrate sizes.

Long Mould Life: Mould life ranges from 300,000 to 1,000,000 shots.

Online Technical Support: Provides 24-hour online professional technical support.

OEM and ODM Services: Available OEM and ODM services for tailored manufacturing.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What are the chip size limits?

Chip size ranges from greater than 0.15mm to 1.5mm.

Q:What is the production cycle time?

The production cycle for one chip is 70 seconds.

Q:What is the XY placement accuracy?

XY placement accuracy is +/- 1.5um@3sigma for chips smaller than 1mm.