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Precision FPC Cutting Machine with UV Laser and CCD System
US$10,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
YesWarranty
12 MonthsModel NO.
HM001Laser Visibility
InvisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
Fiber LaserLaser Classification
Fiber LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingWavelength
532nmPulse Duration
<15PSProcessing Area
250mm × 500mmMachine Dimensions
1700mm × 1650mm × 1850mmCutting Accuracy
±0.02mmRepeatability
≤±0.01mmElectric Power
2.5kwVoltage
220V/380VTransport Package
Air FreightSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Picosecond Green Laser: 532nm wavelength with <15ps pulse width for precision cutting.
Near-Zero Thermal Damage: Cold ablation technology ideal for brittle materials like sapphire and glass.
High Cutting Speed: Up to 500mm/s with galvanometer/scanner hybrid options for high throughput.
Customizable Processing Area: Standard 250mm x 500mm, fully customizable to specific application needs.
Dual Platform Efficiency: Dual platform design improves production efficiency and throughput.
Auto-Focusing Optics: Adaptive optics with auto-focusing for complex geometries and 3D contouring.
Flexible Customization: ODM and OEM services available with flexible customization options.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.15h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for production?
A:
Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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