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Precision FPC Laser Engraving and Cutting Machine for Windows
US$7,000.00-20,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
HM001Laser Visibility
InvisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
Fiber LaserLaser Classification
Fiber LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingLaser Type
Picosecond Green LaserProcessing Area
250mm × 500mmCutting Accuracy
±0.02mmElectric Power
2.5kwMachine Weight
2000kgTemperature
22°C ±2°CEnvironmental Condition Humidity
30%–60%Transport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Picosecond Green Laser: Features ultra-short pulses for minimal thermal damage and superior edge quality.
Large Customizable Work Area: Supports 250mm x 500mm processing area with flexible customization options.
Robust Vibration Damping: Heavy-duty 2000KG frame ensures consistent accuracy by dampening vibrations.
High Efficiency Dual Platform: Dual platform design significantly improves production efficiency.
Automatic Target Finding: Realizes arbitrary fiducial setting and automatic expansion compensation.
Flexible Customization: Offers OEM/ODM services and flexible customization for specific needs.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.71h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What is the maximum processing area?
A:
The standard processing area is 250mm x 500mm, which is customizable.
Q:Does the machine support automatic loading and unloading?
A:
Yes, optional automatic loading and unloading methods are available.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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