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Precision Glass Cutting Tool for Artists and Craftsmen
US$100,000.00-20,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

HMLA-DL05

Application

Automotive Curved Glass

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Applicable Material

Glass

Structure Type

Desktop

Laser Classification

Solid Laser

Laser Technology

Laser Control Fault Cutting

Processing Speed

<200mm/S

Working Edge Breakage

<50μm

Cutting Thickness

<3mm (Single Time)

Working Radius

>0.5mm

Transport Package

Wooden Case

Specification

0*0*0

Trademark

Himalaya

Origin

China

Key features

Non-contact Processing: Minimal material damage with no consumables required for operation.
High Precision Cutting: Achieves edge breakage less than 50 micrometers with linear motor drive.
Customizable Processing Area: Standard 300mm x 400mm with flexible customization options available.
Visual Positioning System: Equipped with HD CCD for automatic typesetting and direct CAD import.
24/7 Technical Support: Professional engineers available online 24 hours a day for assistance.
OEM and ODM Services: Flexible customization services including OEM and ODM options.
Low Operating Cost: Designed for energy efficiency and reduced labor requirements.
1-Year Warranty Coverage: Comprehensive one-year warranty covering mechanical defects.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the maximum cutting thickness?
A:
The machine supports cutting thickness up to 3mm in a single pass.
Q:Can the processing area be customized?
A:
Yes, the standard processing area is 300mm x 400mm, but it is customizable.
Q:What is the processing speed of the machine?
A:
The processing speed is less than 200mm/s.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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Supplier replies will be sent to your registered email

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