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Precision Grinding Machine for Tough and Fragile Materials
US$197,600.00
1 Piece
Product profile
Customization
AvailableDrive Motor
5.5kwSpindle
Tsav 100Model NO.
R400CVSpindle Speed
0-3200 RpmCBN/Diamond
300mmGrinding Wheel
250mm DiameterAxial Run-out
Less Than 2 Micro MeterVacuum Clamping Units
50-450mmWeight
1850kgSize
1360*1030*1970mmTransport Package
Wooden BoxSpecification
1360*1030*1970mmTrademark
HMLYOrigin
GermanyHS Code
9031410000Production Capacity
300Key features
Vacuum Clamping System: Vacuum clamping units range from 50-450mm for secure workpiece holding.
Enclosed Safety Design: Fully encapsulated grinding chamber reduces contamination risks and ensures operator safety.
Versatile Material Processing: Suitable for metals, silicon, semiconductors, and non-metallic workpieces.
User-Friendly Interface: New menu navigation via touch panel with pre-installed grinding programs.
Adjustable Rotary Table: High-precision frequency-controlled rotary table with concave, convex, or parallel adjustments.
Flexible Customization: OEM and ODM services available with flexible customization options for specific needs.
Global Shipping Support: Shipped via sea, land, or flight with fumigated wooden box protection for global delivery.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.93h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What materials can this grinding machine process?
A:
It is designed for metals, silicon, other semiconductor materials, and non-metallic workpieces.
Q:What is the maximum spindle speed?
A:
The spindle speed ranges from 0 to 3200 RPM.
Q:Does the machine support OEM or ODM services?
A:
Yes, both OEM and ODM services are available with flexible customization options.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:How is the product packed for shipping?
A:
It is packed in a fumigated wooden box with soft polyester material protection to ensure safety.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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