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Precision Laser Debonding System for Efficient Material Separation
US$100,000.00-300,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
7*24 HoursFunction
High Temperature ResistanceModel NO.
Himalaya-17Demoulding
AutomaticCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
DesktopDriven Type
ElectricMould Life
>1,000,000 ShotsLaser Type
DPSS (Diode-Pumped Solid-State)Wavelength
UV, < 380 NmPhoton Energy
> 3.26 EVStability
High Stability, Long Service LifeBeam Shaping
Multiple Laser Shaping Technologies IntegratedWafer Size
8 Inches / 12 Inches12-Inch Production
Fully AutomaticTransport Package
Wooden PackSpecification
160*160*230cmTrademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.99h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
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Jiangsu Himalaya Semiconductor Co., Ltd.
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