What are the available payment terms?

We accept LC, T/T, PayPal, and Western Union.

What is the lead time for production?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

Precision Wafer Grinding Systems for Superior Production Output

Name: Precision Wafer Grinding Systems for Superior Production Output
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2079396412

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$200,000.00-500,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Warranty

1 Year

Model NO.

WTGM-300

Application

Automotive Industry

Technical Class

Continuous Wave Laser

Control

Automatic

Power Density

Deep Fusion Welding

Laser Classification

Semiconductor Laser

Type

Silicon Steel Sheet Laser Welding Machine

Material Removal

Reduces The Thickness of Semiconductor Wafers

Target Materials

Silicon Carbide (Sic) Silicon, Gallium Nitride

Initial Thickness Range

200 to 700 Micrometers

Precision

Sub-Micron Level Accuracy

Surface Finish

Below 1 Nanometer

Transport Package

Air Freight

Specification

customized

Trademark

Himalaya

Origin

China

Production Capacity

Key features

Sub-Micron Precision: Achieves sub-micron level accuracy for high-precision wafer thinning applications.

Ultra-Smooth Finish: Delivers surface finish below 1 nanometer for optimal wafer quality.

Automatic Torque Control: Automatically detects grinding torque and adjusts speed to prevent deformation.

Wide Material Compatibility: Processes Silicon Carbide, Silicon, Gallium Nitride, and various alloys and ceramics.

Flexible Customization: Offers flexible customization options for specific machine functions and requirements.

High Grinding Efficiency: Features low grinding resistance and high efficiency with minimal workpiece damage.

Wear Compensation: Automatically compensates for grinding wheel wear thickness during operation.

1-Year Warranty: Includes a comprehensive 1-year warranty with 24-hour online technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.85h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What is the initial thickness range for the wafer?

The machine supports an initial thickness range of 200 to 700 micrometers.

Q:Does the machine support customization?

Yes, flexible customization is available for specific machine functions and requirements.

Q:What is the minimum order quantity?

The minimum order quantity is 1 set.