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Precision Wafer Mounter for Efficient Packaging Solutions Worldwide
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHM8120(120T)Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticPackaging Quantity
2L/F/Time/PressPress Quantity
1-4 PressesApplicable L/F Size
Width:20-80mm Length:124-270mm Thickness:0.1-0.6mmApplicable Resin Size
Diameter 11-20mm(±0.2mm)Molding Pressure
98~1176 kN(Max 120 Tons)Mechanical Time
25 Seconds (Minimum)Machine Specifications
Width 1685mm;Height 1840mm;Length 3725mmMachine Weight
10000 KgTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Precision & Speed: Advanced precision wafer mounter designed for high-speed and high-precision packaging solutions.
Flexible Customization: Supports flexible customization for packaging quantity, press quantity, and applicable L/F and resin sizes.
Strong Molding Pressure: Features a molding pressure range of 98~1176 kN, with a maximum capacity of 120 tons.
ISO Certified Quality: Manufactured under ISO certification standards to ensure reliability and quality control.
Comprehensive Warranty: Includes a 12-month warranty period for the equipment to ensure customer peace of mind.
Professional Technical Support: Provides 24-hour online professional technical support for immediate assistance and troubleshooting.
Versatile Application Range: Applicable for L/F sizes with width 20-80mm and resin diameters of 11-20mm with precise tolerance.
Global Export Experience: Equipment exported to over 30 countries with a proven track record of serving 200+ customers.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.49h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the maximum molding pressure?
A:
The molding pressure ranges from 98 to 1176 kN, with a maximum capacity of 120 tons.
Q:What are the applicable L/F size dimensions?
A:
The applicable L/F size has a width of 20-80mm, length of 124-270mm, and thickness of 0.1-0.6mm.
Q:What is the mechanical time for the machine?
A:
The mechanical time is 25 seconds minimum.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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