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Precision Wafer Mounting Equipment System for Accurate Alignment
US$35,000.00-50,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
KM-02Classification
Mini Laminating MachineApplication
SemiconductorDriven Type
ManualAutomatic Grade
Semi-AutomaticMembrane Material
UV FilmPlastic Film Mulching Modes
Cold LaminatingPerformance
Anti Ultraviolet ErosionWafer Size
6 Inch to 8 InchPower
500WInput Power Supply
100-240V AC 50-60HzAir Pressure
0.5-0.8 MPaFilm Type
Blue Film/UV FilmPlate Heating Temperature
0~65cFilm Thickness
0.05~0.2mmFilm Function
ManualTransport Package
Crate PackSpecification
L933*W450*H317mmTrademark
HimalayaOrigin
ChinaProduction Capacity
200Key features
Precision Vacuum Lamination: Vacuum-sealed environment prevents air entrapment and ensures uniform adhesion for films and foils.
Multi-Size Compatibility: Compatible with wafer sizes from 6 to 8 inches and various film types including Blue and UV films.
Adjustable Pressure System: Unique film roller pressure design ensures even bonding without damaging sensitive substrates.
Dual Cutter Function: Equipped with circular and cross-cutting knives for precise film cutting operations.
Semi-Automatic Operation: Automated substrate handling reduces manpower and avoids human-caused errors.
Flexible Customization: Flexible customization available for wafer size, power, and film function requirements.
High Stability Production: High stability design ensures high yield and prevents bubbles during the lamination process.
Compact Desktop Design: Small size allows for easy desktop placement in semiconductor manufacturing facilities.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What wafer sizes are compatible?
A:
The equipment is compatible with wafer sizes ranging from 6 inches to 8 inches.
Q:What film types can be used?
A:
It supports Blue Film, UV Film, PET substrate film, and double layer film.
Q:Is the machine fully automatic?
A:
The machine is semi-automatic, requiring manual placement of the material box or magazine.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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