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Premium CO2 Laser Engraver for Precision Cutting and Etching
US$50,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
HM001Laser Visibility
InvisibleApplicable Material
MetalCooling System
Air CoolingTechnical Class
Continuous Wave LaserLaser Wavelength
Fiber LaserLaser Classification
Fiber LaserType
YAG Laser Marking MachineMarking Method
Scanning MarkingLaser Type
Picosecond Green LaserProcessing Area
250mmx500mm(Customized)Machine Size
1700×1650×1850mmMachinhe Cutting Accuracy
±0.02mmPower
2.5kwWeight
2000kgHumidity
30 to 60%Transport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
Picosecond Green Laser: 532nm wavelength with ultra-short pulses minimizes heat-affected zones for delicate materials.
Customizable Work Area: Standard 250mmx500mm area can be customized to larger sizes for flexible production needs.
Zero Thermal Damage: Picosecond pulses ablate material without melting edges, ideal for OLEDs and wafers.
Dual Platform Design: Dual platform configuration improves efficiency and allows continuous operation.
12 Months Warranty: Comprehensive one-year warranty coverage for all mechanical equipment.
24/7 Technical Support: Professional technical support available 24 hours online for immediate assistance.
OEM/ODM Services: Flexible customization and design services available for specific client requirements.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.40h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What is the laser type used in this machine?
A:
The machine uses a Picosecond Green Laser with a wavelength of 532nm.
Q:Can the work area be customized?
A:
Yes, the standard 250mmx500mm work area is customizable to larger sizes.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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