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Premium CO2 Laser Engraver for Precision Cutting and Etching
US$50,000.00-100,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Provided

Warranty

12 Months

Model NO.

HM001

Laser Visibility

Invisible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

Fiber Laser

Laser Classification

Fiber Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Laser Type

Picosecond Green Laser

Processing Area

250mmx500mm(Customized)

Machine Size

1700×1650×1850mm

Machinhe Cutting Accuracy

±0.02mm

Power

2.5kw

Weight

2000kg

Humidity

30 to 60%

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Picosecond Green Laser: 532nm wavelength with ultra-short pulses minimizes heat-affected zones for delicate materials.
Customizable Work Area: Standard 250mmx500mm area can be customized to larger sizes for flexible production needs.
Zero Thermal Damage: Picosecond pulses ablate material without melting edges, ideal for OLEDs and wafers.
Dual Platform Design: Dual platform configuration improves efficiency and allows continuous operation.
12 Months Warranty: Comprehensive one-year warranty coverage for all mechanical equipment.
24/7 Technical Support: Professional technical support available 24 hours online for immediate assistance.
OEM/ODM Services: Flexible customization and design services available for specific client requirements.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.40h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What is the laser type used in this machine?
A:
The machine uses a Picosecond Green Laser with a wavelength of 532nm.
Q:Can the work area be customized?
A:
Yes, the standard 250mmx500mm work area is customizable to larger sizes.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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