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Premium Customized Wafer Cleaning Equipment for Semiconductor Industry
US$100,000.00-1,000,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

HMLA-150C

Cleaning Station

Belt Transfer Type 6 Station

Wafer Size

3-6 Inch

Scrub Station *2

2 PVA Brushes, Double-Sided Cleaning

Customized

Allowed

Label

Allowed

Transport Package

Wooden Case

Specification

0*0*0

Trademark

none

Origin

China

Key features

Flexible Customization: Allows customization of cleaning stations, wafer sizes, and labels.
Double-Sided PVA Scrubbing: Equipped with double-sided PVA brushes for efficient wafer cleaning.
Mega-Sonic Cleaning: Integrates mega-sonic cleaning technology for superior results.
Automatic Loading System: Features robot arm transportation and cassette in/out capabilities.
Touch Screen PLC Control: Operated via a user-friendly touch screen PLC control system.
1-Year Warranty: Includes a comprehensive 1-year warranty for mechanical defects.
100% Product Inspection: Every finished product undergoes visual and functional inspection.
OEM/ODM Services: Supports both OEM and ODM services for flexible manufacturing.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.64h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:What is the warranty period?
A:
We provide a 1-year warranty for this equipment.
Q:Can the machine be customized?
A:
Yes, we offer flexible customization for cleaning stations, wafer sizes, and labels.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What is the lead time for production?
A:
Lead time is 1-3 months during off-season and 3-6 months during peak season.
Q:What wafer sizes are supported?
A:
The machine supports wafer sizes ranging from 3 to 6 inches.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
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