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Reliable Laser Engraving Machine for Circuit Board Precision
US$1,000.00-7,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Warranty

Provided

Model NO.

PCBM-1104

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

Fiber Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Laser Type

Ultraviolet (UV) Laser

Wavelength

355 Nm

Processing Method

Cold" Ablation (Minimal Heat-Affected Zone)

Pulse Width

Nanosecond

Beam Quality

High (Enables Fine Focusing)

Marking Speed

up to 800mm/S

Software Controllability

Complex Graphics and Automation

Wide Material Compatibility

Plastics, Metals, Glass, Ceramics, PCB Substrates

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Cold Laser Processing: Minimal heat-affected zone ensures high quality processing without thermal damage.
High Efficiency Speed: Marking speed up to 250 characters/sec for high efficiency and precision.
Low Maintenance Cost: No consumables required, resulting in low cost and low maintenance fees.
Stable Performance: Overall machine design supports stable performance and long-term operation.
Customizable Options: Flexible customization available for laser type, wavelength, and processing methods.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.13h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the marking speed of the machine?
A:
The marking speed is up to 250 characters/sec, ensuring high efficiency.
Q:What materials can this laser engraver process?
A:
It is compatible with metals, plastics, glass, ceramics, PCB substrates, and flexible circuits.
Q:Does the machine require consumables?
A:
No, the machine has no consumables, which results in low cost and low maintenance fees.

Send Inquiry

*To:Jiangsu Himalaya Semiconductor Co., Ltd.Jiangsu Himalaya Semiconductor Co., Ltd.
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