Smart Automated Lamination System for Streamlined Industrial Production

Name: Smart Automated Lamination System for Streamlined Industrial Production
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2105755782

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$500,000.00-800,000.00

1 Piece

Product profile

Customization

Available

Feature 1

High Precision

Feature 2

High Efficiency

Model NO.

HMLY-H01

After-Sale Service

Provided

Short-Side Butyl Adhesive

Width: 2-3mm, Thickness: 0.3±0.05mm

Alignment Targets

Fiducial Markers on Substrate (ø200μm)

Insulation Resistance

>100MΩ @1000VDC

Size

9200×2000×2000mm

Conductive Adhesive Contact Resistance

<10MΩ Per 10mm Length

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Versatile Module Support: Suitable for Perovskite single-junction, 2T and 4T tandem modules.

Comprehensive Automation: Integrates butyl, insulating, busbar, and conductive adhesive processes.

Flexible Customization: OEM/ODM/Designing service available for tailored machine solutions.

Reliable Warranty: One year warranty with 24 hours online professional technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing service.

Q:What module types are supported?

Suitable for Perovskite single-junction, 2T and 4T tandem modules.