What after-sales services are included?

Services include free training, a one-year warranty, and 24-hour online technical support.

Superior Laser Cutting Solutions for Enhanced Semiconductor Production

Name: Superior Laser Cutting Solutions for Enhanced Semiconductor Production
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2082660662

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$70,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Warranty

1 Year

Model NO.

WBM-0131-3

Laser Type

Infrared Picosecond Pulsed Laser

Cooling Method

Air-Cooled

X-Axis

Stroke 450mm, Resolution 0.1μm

Y-Axis

Stroke 700mm, Resolution 0.1μm

Z-Axis

Stroke 20mm, Resolution 0.1μm

θ Axis

Travel 120°, Resolution 0.001°

Transport Package

Wooden Case

Specification

customized

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Ultra-Short Pulse Laser: Infrared picosecond pulsed laser for high quality and efficient cutting.

SiC Wafer Specialization: Specifically designed for cutting silicon carbide wafers in power devices.

Complete Solution: Provides a complete set of split and expansion equipment.

Flexible Customization: Flexible customization options available for machine requirements.

1-Year Warranty: Comprehensive one-year warranty coverage for the equipment.

24/7 Technical Support: 24 hours online professional technical support included.

Free Training: Complimentary training provided with the equipment purchase.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What materials can this machine process?

It is specifically designed for cutting silicon carbide (SiC) wafers used in microwave and power devices.

Q:What is the processing size capacity?

Standard processing size is 6 inches, which is upgradeable to 8 inches.

Q:Does the machine offer customization?

Yes, flexible customization options are available to meet specific requirements.